RoHS 豁免清單更新 條款已達(dá) 39 項(xiàng)

RoHS豁免 LED中鎘

2010.2.26，歐盟在官方公報(bào)上公布委員會(huì)決定2010/122/EU，鑒于對(duì)LED中的鎘進(jìn)行替代，在技術(shù)上還不成熟，決定對(duì)其進(jìn)行豁免。至此，RoHS指令附錄（即豁免清單)條款，增加至第39條。

 

RoHS最新豁免清單

1.   Mercury in compact fluorescent lamps not exceeding 5 mg per lamp 小型日光燈中的汞含量不得超過5毫克/燈  

2.   Mercury in straight fluorescent lamps for general purposes not exceeding: halophosphate 10 mg,

triphosphate with normal lifetime 5 mg , triphosphate with long lifetime 8 mg. 一般用途的直管日光燈中的汞含量不得超過： 鹽磷酸鹽10毫克, 正常的三磷酸鹽5毫克 , 長(zhǎng)效的三磷酸鹽8毫克 .

3.   Mercury in straight f1uorescent lamps for special purposes 特殊用途的直管日光燈中的

汞含量

4. Mercury in other lamps not specifically mentioned in this Annex. 本附錄中未特別提及的其它

照明燈中的汞含量

5.   Lead in glass of cathode ray tubes, electronic components and f1uorescent tubes. 陰極射線管、電子部件和發(fā)光管的玻璃內(nèi)的鉛含量

6. Lead as an alloying element in steel containing up to 0.35% lead by weight, aluminium containing up to 0.4% lead by weight and as a copper alloy containing up to 4% lead by weight.鋼中合金元素中的鉛含量達(dá)0.35%，鋁含量達(dá) 0.4%，銅合金中的鉛含量達(dá)4%

7.   Lead in high melting temperature type solders (i.e.lead-based alloys containing 85 % by weight

or more lead); lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signalling, transmission as well as network management for Telecommunications; lead in electronic ceramic parts (e.g. piezoelectronic devices).

高溫融化型焊錫鉛（如：鉛含量≥85%的合金中的鉛）；用于服務(wù)器，存儲(chǔ)器和存儲(chǔ)陣列的焊料中的鉛。用于交

換、信號(hào)產(chǎn)生和傳輸，以及電信網(wǎng)絡(luò)管理的網(wǎng)絡(luò)基礎(chǔ)設(shè)施設(shè)備中焊料中的鉛； 電子陶瓷部件中（如：高壓

電子裝置）的鉛   

8. Cadmium and its compounds in electrical contacts and cadmium plating except for applications banned under Directive 91/338/EEC amending Directive 76/769/EEC relating to restrictions on the marketing and use of certain dangerous substances and preparations 電觸點(diǎn)中的鎘及鎘化合物以及91/338/EEC 指令限制范圍以外的鎘電  

9.   Hexavalent chromium as an anti-corrosion of the carbon steel cooling system in absorption

refrigerators. 在吸收式電冰箱中作為碳鋼冷卻系統(tǒng)防腐劑的六價(jià)鉻； 

9a DecaBDE in polymeric applications; (2005/717/EC) 聚合體中使用的十溴二苯醚(2005/717/EC)（豁免至

2008.6.30)

9b Lead in lead-bronze bearing shells and bushes. (2005/717/EC) 在鉛-銅軸承外殼與襯套中的

鉛(2005/717/EC)  

10.   Within the procedure referred to in Article 7(2),the Commission shall evaluate the applications for: (2005/717/EC) mercury in straight fluorescent lamps for special purposes, light bulbs, as a matter of priority in order-to establish as soon as possible whether these items are to be amended accordingly.

根據(jù)在第7(2)條中提及的程序，歐盟委員會(huì)應(yīng)評(píng)價(jià)以下方面的應(yīng)用(2005/717/EC)： 特殊用途的直管熒光燈中的

汞；

11.   Lead used in compliant pin connector systems.(2005/747/EC) 插腳式連接器系統(tǒng)中使用的鉛；(2005/747/EC)

12.   Lead as a coating material for the thermal conduction module c-ring. (2005/747/EC) 熱導(dǎo)模組C環(huán)涂層中所用的鉛；(2005/747/EC)

13.   Lead and cadmium in optical and filter glass. (2005/747/EC) 光學(xué)玻璃及濾光玻璃中所用的鉛及鎘；(2005/747/EC)

14.   Lead in solders consisting of more than two elements for the connection between the pins and

the package of microprocessors with a lead content of more than 80% and less than 85% by weight. (2005/747/EC) 微處理器針腳及封裝聯(lián)接所使用的含兩種以上組分的焊料中的鉛（鉛含量在80%和85%之間）；(2005/747/EC)

15.   Lead in solders to complete a viable electrical connection between semiconductor die and

carrier within integrated circuit Flip Chip packages. (2005/747/EC)集成電路倒裝芯片封裝中半導(dǎo)體芯片及載體之間形成可靠聯(lián)接所用的鉛；(2005/747/EC)

16.   Lead in linear incandescent lamps with silicate coated tubes.(2006/310/EC) 線形白熾燈硅酸鹽燈管中的鉛；(2006/310/EC)

17. Lead halide as radiant agent in High Intensity Discharge(HID) lamps used for professional

reprography applications. (2006/310/EC) 用于專業(yè)復(fù)印設(shè)備的高強(qiáng)度放電燈(HID)中用作激發(fā)的鹵素鉛；(2006/310/EC)

18.   Lead as activator in the fluorescent powder (1% lead by weight or less) of discharge amps when used as sun tanning lamps containing phosphors such as BSP(BaSi2O5:Pb) as well as when used as

speciality lamps for diazo-printing reprography, lithography, insect traps,photochemical and curing processes containing phosphors such as SMS((Sr,Ba)2MgSi2O7:Pb)(2006/310/EC) 當(dāng)放電燈被用作含磷的仿日曬燈(sun tanning lamps)，比如含有BSP(BaSi2O5:Pb)， 以及用于重氮復(fù)印、平版印刷、捕蟲器、光化

學(xué)和食物加工過程的特種燈，含有磷時(shí)，比如SMS((Sr,Ba)2MgSi2O7:Pb)，放電燈中的熒光粉觸媒劑的鉛含量在

其重量的1％或以下；(2006/310/EC)

19.   Lead with PbBiSn-Hg and PbInSn-Hg in specific compositions as main amalgam and with PbSn-Hg as auxiliary amalgam in very compact Energy Saving Lamps (ESL). (2006/310/EC) 緊湊型節(jié)能燈(ESL)中作為主要汞齊合金的特定成分(PbBiSn-Hg和PbinSg-Hg)中的鉛以及作為輔助汞合金PbSn-Hg中的鉛；

(2006/310/EC)

20.   Lead oxide in glass used for bonding front and rear substrates of flat fluorescent lamps

used for Liquid Crystal Displays (LCD).(2006/310/EC) 液晶顯示器(LCD)用于連接平面熒光燈前后基片用的玻璃中的氧化鉛；(2006/310/EC)

21.   Lead and cadmium in printing inks for the application of enamels on borosilicate glass.

(2006/691/EC) 用于硼硅酸鹽玻璃瓷漆的印墨所含的鉛及鎘；(2006/691/EC)

22.  Lead as impurity in RIG (rare earth iron garnet) Faraday rotators used for fibre optic

communications systems. (2006/691/EC) 在光纖通訊系統(tǒng)稀土鐵石榴石法拉第旋轉(zhuǎn)器中作為雜質(zhì)的鉛；(2006/691/EC)（豁免至2011.1.1）

23.   Lead in finishes of fine pitch components other than connectors with a pitch of 0.65mm or less with NiFe lead frames and lead in finishes of fine pitch components other than connectors with a pitch of 0.65 mm or less with copper lead frames. (2006/691/EC) 使用鐵鎳合金或者銅引線框架的細(xì)間距元器件（即不大于0.65mm的引腳間距）的表面處理中的鉛，不包括連接器類；(2006/691/EC)

24. Lead in solders for the soldering to achined through hole discoidal and planar array ceramic multilayer capacitors. (2006/691/EC) 通孔盤狀及平面陣列陶瓷多層電容器焊料所含的鉛；(2006/691/EC)

25.   Lead oxide in plasma display panels (PDP) and surface conduction electron emitter displays (SED) used in structural elements; notably in the front and rear glass dielectric layer, the bus electrode, the black stripe, the address electrode, the barrier ribs, the seal frit and frit ring as well as in print pastes. (2006/691/EC) 等離子顯示屏（PDP）及表面?zhèn)鲗?dǎo)式電子發(fā)射顯示器（SED）的部件中的氧化鉛，特別是玻璃前后絕緣層、總線電極、黑條（彩色顯像管）、尋址電極、阻擋層肋柱、密封玻璃料以及封裝玻璃、環(huán)狀玻璃、印墨中；(2006/691/EC)

26.   Lead oxide in the glass envelope of BlackLight Blue (BLB) lamps. (2006/691/EC) 藍(lán)黑燈管（BLB）玻璃外罩所含的氧化鉛；(2006/691/EC)

27.   Lead alloys as solder for transducers used in high-powered (designated to operate for

everal hours at acoustic power levels of 125 dB SPL and above) loudspeakers.(2006/691/EC) 在大功率揚(yáng)聲器中作為轉(zhuǎn)換器焊料的鉛合金；(2006/691/EC)

28.   Hexavalent chromium in corrosion preventive coatings of unpainted metal sheetings and fasteners used for corrosion protection and Electromagnetic Interference Shielding inequipment falling under

category three of Directive 2002/96/EC (IT and telecommunications equipment).Exemption granted until 1 July 2007. (2006/692/EC) 2002/96/EC指令（IT及電信設(shè)備）涉及的第三類設(shè)備中用來(lái)防止腐蝕和干擾的未噴漆金屬薄板及緊固件上防腐涂層中的六價(jià)鉻。(2006/692/EC)( 豁免至2007.7.1)

29.   Lead bound in crystal glass as defined in Annex I (Categories 1, 2, 3 and 4) of Council Directive 69/493/EEC. (2006/690/EC ) 理事會(huì)指令69/493/EEC附件I（第1、2、3和4類）中定義的水晶玻璃中的鉛(2006/690/EC)

30.   Cadmium alloys as electrical/mechanical solder joints to electrical conductors located

directly on the voice coil in transducers used in high-powered loudspeakers with sound pressure levels of 100 dB (A) and more. (2008/385/EC ) 用于音壓在100分貝以上的大功率揚(yáng)聲器，在變頻器中直接裝置

到受話器的上，作為電氣/機(jī)械焊料的鎘合金；(2008/385/EC)

31.   Lead in soldering materials in mercury free flat fluorescent lamps (which e.g. are used

for liquid crystal displays, design or industrial lighting). (2008/385/EC ) 無(wú)汞平板熒光燈內(nèi)焊接材料中的鉛（例如用于液晶顯示器、設(shè)計(jì)或工業(yè)用明）；(2008/385/EC)

32.   Lead oxide in seal frit used for making window assemblies for Argon and Krypton laser tubes. (2008/385/EC) 用于氬和氪激光管窗體組件制造的密封釉料中的氧化鉛；(2008/385/EC)

33.   Lead in solders for the soldering of thin copper wires of 100μm diameter and less in

power transformers. 直徑100微米的細(xì)銅線和小于直徑100微米的電力變壓器的焊料中的鉛；

34.   Lead in cermet-based trimmer potentiometer elements. 金屬陶瓷質(zhì)的微調(diào)電位器中的鉛含量；

35.   Cadmium in photoresistors for optocouplers applied in professional audio equipment until 31 December 2009. 專業(yè)音頻設(shè)備中的光耦合器的元件、光電阻的鎘的應(yīng)用（豁免至2009.12.31）

 36.   Mercury used as a cathode sputtering inhibitor in DC plasma displays with a content up to 30 mg per display until 1 July 2010. 直流等離子顯示器中，作為陰極濺射抑制劑中的汞在第個(gè)顯示器中的含量不得超過30毫克（豁免至2010.7.1）

37.   Lead in the plating layer of high voltage diodes on the basis of a zinc borate glass body

以硼酸鋅玻璃體為基礎(chǔ)的高壓二極管的電鍍層的鉛含量

38.Cadmium and cadmium oxide in thick film pastes used on aluminium bonded beryllium oxide. 用氧化鈹連接鋁制成的厚膜漿料中鎘和氧化鎘的含量  

39.Cadmium in colour converting II-VI LEDs (< 10 μg Cd per mm2 of light-emitting area) for use in solid state illumination or display systems until 1 July 2014 用于固態(tài)照明或顯示使用系統(tǒng)中的彩色轉(zhuǎn)換II - VI族發(fā)光二極管(小于10微克每平方毫米的發(fā)光區(qū)域)內(nèi)所含的鎘（豁免至2014.7.1）

(以上中文翻譯僅供參考，如有歧義，請(qǐng)以英文原文為準(zhǔn))

2009底，歐盟議會(huì)議員提出一份修訂報(bào)告，針對(duì)2008年12月3日歐盟執(zhí)委會(huì)公告的RoHS修正草案進(jìn)行大幅修訂。在此份修訂報(bào)告中，RoHS將擴(kuò)大管制范圍，并在電子電氣產(chǎn)品中新增更多有害物質(zhì)的限制。作為企業(yè)得以最大限度降低RoHS指令影響，為產(chǎn)品出口贏得轉(zhuǎn)機(jī)的利好參考，RoHS豁免清單的任何細(xì)微調(diào)整，企業(yè)都應(yīng)引起足夠重視。針對(duì)可豁免項(xiàng)目，提出如下建議：

要充分了解熟悉RoHS指令的豁免清單和豁免期限，提高合理利用豁免規(guī)則的意識(shí)，積極為自己的產(chǎn)品申請(qǐng)豁免以爭(zhēng)取更寬闊的生存空間；

加強(qiáng)供應(yīng)商采購(gòu)控制管理，盡可能要求提供原材料成分聲明，采購(gòu)達(dá)到RoHS要求的元器件和原材料，對(duì)不確定的供應(yīng)商材料要進(jìn)行內(nèi)外部測(cè)試，確保不摻雜有害物質(zhì)以符合申請(qǐng)豁免條件；

豁免項(xiàng)目針對(duì)的是產(chǎn)品中的特定有害物的應(yīng)用，而非整個(gè)產(chǎn)品被豁免，如一零部件中焊料中的鉛是符合RoHS指令的，但不代表該零部件產(chǎn)品就能被豁免，同一部件中仍不能含有其它限制形式的鉛或其它五種被限制物質(zhì)。

據(jù)悉，歐盟暫定2010.5.4，對(duì)RoHS修訂報(bào)告進(jìn)行一讀程序，5.18進(jìn)行全體會(huì)議。