單組份，導(dǎo)熱系數(shù)25W/mK，適合3-5W大功率LED和模組。自動(dòng)點(diǎn)膠機(jī)適用。

Introduction
   Die Attach Paste  ”KEMITITE CT285” is epoxy resin based and solvent free Type paste.

   The highest thermal conductivity (25W/mK)

   Good reflow performance due lower moisture absorption resin system.

   CT285 is effectively used for power IC, transistor.

Features
1） Good workability for dispensing due to solvent free and one liquid type paste.

2） Highest thermal conductivity(25W/mK)

3） Bleed less.

General Property
Properties
 Unit
 Typical Value
 Test Method
 
Appearance
 –
 Silver Filled Paste
 Visual
 
Viscosity at 25CPa·s100EHD Viscometer 0.5rpm3°cone)
 
Thixotropic Index
 –6.0 0.5rpm/2.5rpm
 
Non Voletile
 Wt%92.0 180C×2hr
 
Silver Content
 Wt%87.5 600C×3hr
 
Adhesive Strength
 25c300CN3020
 Frame: Cu/PPF

Chip Size: 2×2mm
 
Volume Resistivity
 Ohm.cm
 8×10-6
 Cure: 200C×90min

Measurement: Room Temp
 
Glass Transition Temperature
 C200TMA
 
Modulus(25C)
 25CGPa16.5DMA
 260C 7.8
 
CTE
 Alpha 1Ppm75TMA
 Alpha 2
 200
 
Ionic Impurity
 Nappm61
 Atomic Absorption
Ionchromatography
 CIThermal Conductivity
 W/m K25
 Laser Flash
4.  Standard Cure Condition
175C×60-90min

5. Remarks
Storage condition is _30 to _15C 6 month