PRODUCT DESCRIPTION
UV6292isone component, epoxy based, cationic curable adhesive. The material cures when exposed to ultraviolet radiation. C-UV6292 is used to bond, seal metal or glass components with high strength and chemical resistance. Temperature exposure can be up to 200 °C. The cured material has very low ionic contents with low outgassing, which is well suitable for use in electronic encapsulating, such as cover glass bonding of CCD/CMOS area image packages.
PROPERTIES OF UNCURED MATERIAL
| Property | Test Method | Value |
| Color/Appearance | Visual | clear liquid |
| Specific Gravity | ASTM D-792 | 1.1 |
| Viscositycps, 25 °C | Brookfield, #7，10rpm | 4,000 -6,000 |
| Shelf life@20 °C, month |
| 6 |
TYPICAL PROPERTIES OF CURED MATERIAL
Material cured at 30 sec x200 mW/ cm2
| Property | Test Method | Value |
| Tack free time | 100 mW/ cm2 | < 8 sec |
| Depth of cure | 60 seconds x 100 mW/ cm2 | 0.6 mm |
| Tensile strengt, N/mm2, glass to glass | 30 seconds x 100 mW/ cm2plus 60 minx125C | 3.5 |
| Glass transition temperature Tg °C |
| 145 |
| Coefficient of thermo expansion cm/cm/°C | RT to 125 °C | 60 |
| Chemical / solvent resistance
| Most oil, solvents gasoline, water. alcohols, | Excellent resistance |
| Dielectric strengthkv /mm | ASTM D149 | 35 |
| Surface resistivity,Ω | ASTM D257 | 4.5 E+15 |
| Volume resistivity,Ω.CM | ASTM D257 | 3.8 E+14 |
| Dielectric constant/Dissipation factor | ASTM D150 | 3.6/0.02 (1 kHz) |
|
|
| 3.5/0.03 (1000 kHz) |
STORAGE INFORMATION
Store at 8 – 22 °C in a dry, cool place and in sealed containers out of direct sunlight.
