| 基本 描述 | 模塊類型 | 傳輸距離 | 傳輸介質(zhì) | 傳輸波長(zhǎng) | 接口類型 | 傳輸速率 | ||||
| XFP | 300 m | 多模光纖 | 850 | 雙LC接口 | 10.5 Gb/s | |||||
具體描述：
收發(fā)一體XFP模塊 ;
最高速率10.5 Gb/s,
LC接口,
波長(zhǎng)：850 nm,
傳輸距離:300m.
可熱拔插
工作溫度：0℃~70℃
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Hot-pluggable XFP footprint
Supports 9.95Gb/s to 10.5Gb/s bit rates
Power dissipation <1.5W
RoHS-6 compliant (lead-free)
Temperature range 0°C to 70°C
Single power supply: 3.3V
Maximum link length of 300m
Uncooled 850nm VCSEL laser
Duplex LC connector
No Reference Clock required
Built-in digital diagnostic functions
Standard bail release mechanism
Applications
10GBASE-SR/SW 10G Ethernet
1200-Mx-SN-I 10G Fibre Channel
