Model

No/ Features

Made

KE-730

0.28set/chip 80cst Laser,3 head

95-98

KE-740

0.34set/chip 80cst,Laser 2 head

95-98

KE-750

0.25set/chip 80cst,Laser,3 head

98-

KE-760

0.32set/chip 1.8sec/QFP,80cst/20tray,Laser 2 head,BGA

98-

KE-2010

0.33set/chip 1 multi nozzle laser head(4 nozzle),From 0603(0201)chip to 26.5-11mm chip 20mm spuare chip

97-

KE-2020

0.33sec/chip,2sec/IC,1 multi nozzle laser head(4 nozzle)1 high-resolution head(1-nozzles),From 0603(0201) chip to 50mm spuare chip

97-

KE-2030

0.18sec/chip,multi laser head*2(8 nozzle),From 0603(0201)chip to 26.5-11mm chip 20mm spuare chip

97-

KE-2050

13,200CPH：芯片(激光識別 / 實(shí)際生產(chǎn)工效)激光貼片頭×1個（4吸嘴）0603（英制0201）芯片～20mm方形元件、或26.5×11mm 0402（英制01005）芯片為出廠時選項(xiàng)

KE-2060

12,500CPH：芯片(激光識別 / 實(shí)際生產(chǎn)工效)1,850CPH：IC（圖像識別 / 實(shí)際生產(chǎn)工效），3,400CPH：IC（圖像識別 / 使用MNVC）激光貼片頭×1個（4吸嘴）&高分辨率視覺貼裝頭×1個（1吸嘴)0603芯片（英制0201）芯片～33.5mm方元件0402（英制01005）芯片為出廠時選項(xiàng)