田村 tamura 低銀錫膏GP-216-HF17  衡鵬企業(yè)為您供應(yīng)

LFSOLDER GP-216-HF17 is a Pb-free and cleaning-free

Table 1 Characteristics

Fig.1 SEM photograph of solder powder

solder paste used Pb-free spherical solde powder and

flux. Since this solder paste contains no Pb, the usage of

hazardous materials is reduced, furthermore, the

and the safe workplace are protected. As its flux residue

contains no halides, it can be remained on the PCB

　 heater and conveyor during reflowing.

　 temperature.

● Superior reliability is provided by no washing.

● Stable printability with little change in viscosity

?? during continuous printing.

● Pb-free (Sn/Ag/Cu series) solder alloy is used.

● Excellent wettability for electronic component and land p

● Having a good solderability even in air reflow.

● Excellent solderability can be attained for a high peak

2.Outstanding features

cleaning.

Items                    Characteristics                    Test methods

Alloy composition      Sn96.8/Ag0.3/Cu0.7/Bi2.0/In0.2       JIS Z 3282??1999

Melting point          210??224??                           According to DSC

Particle size of

solder powder          20-36μm                            According to laserdiffraction method

Flux content           12.5%                                JIS??Z??3284 (1994)

Chlorine content       0.0??                                JIS??Z??3197??(1999)

Viscosity              200Pa??s                             Annex 6 to JIS Z

3284 (1994)