Specification

Alignment

> 2.0Cmk@ ±12.5μm, (±6 Sigma) *

Machine Capability

> 2.0Cmk@ ±25μm, (±6 Sigma) #

Optimum Core Cycle Time

8 seconds

Operating System

Windows 7 Standard embedded

Squeegee Pressure Mechanism

Software controlled, motorised with closed loop feedback

Stencil Positioning

Semi-auto stencil load with drip tray

Stencil Frame Size and Thickness

Frame variants – Fully adjustable to accommodate frame sizes in the range of 305mm to 736mm

Under Stencil Cleaning

Interchangeable Under Stencil (IUSC) cleaner, fully programmable with wet/dry/vacuum wipe

Substrate Size

50mm (X) x 40.5mm (Y) to 620mm (X) x 508.5mm (Y)

Substrate Thickness

0.2mm to 6mm

Substrate Weight (maximum)

6kg

Substrate Warpage

Up to 7mm including substrate thickness

Substrate Fixture

Over the top clamps
Edge clamps
Foil-less clamps
Vacuum

Print Pressure

0kg to 20kg

Print Speed

2mm/sec to 150mm/sec

Connectivity

RJ-45LAN (networking) and USB2 interface available

Temperature & Humidity Sensor

Monitoring of the process environment

CE

98/37/EC
89/336/EEC
73/23/EEC
Subsequent amendments

Voltage

115 Volts to 230 Volts ±10%.  Single phase 50/60 Hz

Over Current Protection

An external circuit breaker ≤25 Amps is required to be fitted in line with the machine supply

Air Supply

To ISO 8573.1 Standard Quality Class 2.3.3
Pressure 5 bar to 8 bar

Approximate Weight

810kg boxed (dependent upon configured options selected with machine)
654kg unboxed (dependent upon configured options selected with machine)

Approximate Dimensions

1342mm (W) x 1624mm (D) x 1472mm (H)